The Microstructure Investigation of Flip-Chip Laser Diode Bonding on Silicon Substrate by Using Indium-Gold Solder

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 3, 2003, Pages 635-641

  Liu, Chien Chih ^a   Lin, Yen Kuang ^a   Houng, Mau Phon ^a   Wang, Yeong Her ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Flip chip; High temperature storage test; Indium gold; Microstructure; Solder; Thermal shock test

Indexed keywords

BONDING; FLIP CHIP DEVICES; GOLD; INDIUM; MICROSTRUCTURE; OPTOELECTRONIC DEVICES; SEMICONDUCTOR LASERS; SILICON; SOLDERING; SOLDERING ALLOYS; THERMODYNAMIC STABILITY;

THERMAL SHOCK TESTS;

ELECTRONICS PACKAGING;

EID: 0142165075     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.817655     Document Type: Article

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