Microstructure and resistivity characterization of CuAu I superlattice formed in Cu/Au thin films

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 22, Issue 6, 2004, Pages 2715-2718

  Zhang, W ^a,b   Brongersma, S H ^a   Richard, O ^a   Brijs, B ^a   Palmans, R ^a   Froyen, L ^b   Maex, K ^a,b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY; GOLD; INTERDIFFUSION (SOLIDS); INTERMETALLICS; METALLIZING; MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; SUPERLATTICES; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

ANTIPHASE BOUNDARIES; NANOSCALE METALLIZATION; PHASE FORMATIONS; THIN METAL FILMS;

COPPER;

EID: 13244272411     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1819899     Document Type: Article

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