Lifetime model for flip-chip on flex using anisotropic conductive adhesive under moisture and temperature loading

2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM

Volumn , Issue , 2008, Pages 799-808

  Wunderle, B ^a   Kallmayer, C ^a   Walter, H ^a   Braun, T ^a   Michel, B ^a   Reichl, H ^b  

^a Fraunhofer Institute Reliability and Microintegration   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

ACA; Flex; Flip chip; Moisture; Reliability; Temperature

Indexed keywords

ADHESIVE JOINTS; ANISOTROPY; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS ENGINEERING; ELECTRONICS PACKAGING; FIGHTER AIRCRAFT; FINITE ELEMENT METHOD; FORMING; MECHANICAL PROPERTIES; MOISTURE; SILVER; THERMOMECHANICAL TREATMENT;

ACA; FLEX; FLIP-CHIP; RELIABILITY; TEMPERATURE;

FAILURE ANALYSIS;

EID: 50949101189     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2008.4544349     Document Type: Conference Paper

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