Semiconductor wafer bonding: A flexible approach to materials combinations in microelectronics; micromechanics and optoelectronics

Proceedings of the International Semiconductor Conference, CAS

Volumn 1, Issue , 1997, Pages 23-32

  Goesele, U ^a   Alexe, M ^a   Kopperschmidt, P ^a   Tong, Q Y ^a  

^a MAX PLANCK INSTITUTE OF MICROSTRUCTURE PHYSICS   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; HYDROGEN; ION IMPLANTATION; SILICON ON INSULATOR TECHNOLOGY; SUBSTRATES; VACUUM APPLICATIONS;

SEMICONDUCTOR WAFER BONDING;

SILICON WAFERS;

EID: 0030640725     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (64)