Characterization of Cation Depletion in Pyrex during Electrostatic Bonding

Journal of the Electrochemical Society

Volumn 150, Issue 10, 2003, Pages

  Van Helvoort, A T J ^a   Knowles, K M ^a   Fernie, J A ^b  

^a UNIVERSITY OF CAMBRIDGE   (United Kingdom)

^b TWI LTD   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL BONDS; INTERFACES (MATERIALS); POTASSIUM; PRESSURE EFFECTS; SODIUM;

CATION DEPLETION;

SILICON;

EID: 0142021034     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1604116     Document Type: Article

References (37)

1. G. Wallis and D. I. Pomerantz, J. Appl. Phys., 40, 3946 (1969).
2. T. Rogers and J. Kowal, Sens. Actuators A, 46-47, 113 (1995).
3. J. J. Hofmann, J. B. Elledge, Z.-Y. Xia, and D. A. Cathey, U.S. Pat. 5,980,349 (1999).
4. D-J. Lee, Y-H. Lee, J. Jang, and B-K. Ju, Sens. Actuators A, 89, 43 (2001).
5. T. T. Veenstra, J. W. Berenschot, J. G. E. Gardeniers, R. G. P. Sanders, M. C. Elwenspoek, and A. van den Berg, J. Electrochem. Soc., 148, G68 (2001).
6. G. E. Spangler and E. S. Kolesar, J. Micromech. Microeng., 12, 541 (2002).
7. T. R. Anthony, J. Appl. Phys., 54, 2419 (1983).
8. P. Nitzsche, K. Lange, B. Schmidt, S. Grigull, U. Kreissig, B. Thomas, and K. Herzog, J. Electrochem. Soc., 145, 1755 (1998).
9. S. Mack, H. Baumann, U. Gösele, H. Werner, and R. Schlögl, J. Electrochem. Soc., 144, 1106 (1997).
10. D. E. Carlson, K. W. Hang, and G. F. Stockdale, J. Am. Ceram. Soc., 55, 337 (1972).
11. D. E. Carlson, J. Am. Ceram. Soc., 57, 291 (1974).
12. E. T. Enikov and J. G. Boyd, Int. J. Eng. Sci., 38, 135 (2000).
13. A. Cozma and B. Puers, J. Micromech. Microeng., 5, 98 (1995).
14. D. S. Hurd, R. Caretta, and W. W. Gerberich, J. Mater. Res., 10, 387 (1995).
15. M. L. Dunn, S. J. Cunningham, and P. E. W. Labossiere, Acta Mater., 48, 735 (2000).
16. G. Wallis, J. Am. Ceram. Soc., 53, 563 (1970).
17. K. B. Albaugh, J. Electrochem. Soc., 138, 3089 (1991).
18. M. A. Morsy, K. Ikeuchi, M. Ushio, and H. Abe, Mater. Trans., JIM, 37, 1511 (1996).
19. K. B. Albaugh and D. H. Rasmussen, J. Am. Ceram. Soc., 75, 2644 (1992).
20. T. M. H. Lee, D. H. Y. Lee, C. Y. N. Liaw, A. I. K. Lao, and I-M. Hsing, Sens. Actuators A, 86, 103 (2000).
21. M. P. Borom, J. Am. Ceram. Soc., 56, 254 (1972).
22. D. E. Carlson, K. W. Hang, and G. F. Stockdale, J. Am. Ceram. Soc., 57, 295 (1974).
23. R. G. Gossink, J. Am. Ceram. Soc., 61, 539 (1978).
24. U. K. Krieger and W. A. Lanford, J. Non-Cryst. Solids, 102, 50 (1988).
25. M. A. Morsy, K. Ikeuchi, M. Takahashi, and M. Ushio, in Proceeding of Trends in Welding Research, 5th International Conference, p. 251, June 1-5, 1998.
26. Q. Xing, G. Sasaki, and H. Fukunaga, J. Mater. Sci.: Mater. Electron., 13, 83 (2002).
27. A. T. J. van Helvoort, K. M. Knowles, C. B. Boothroyd, and J. A. Fernie, Inst. Phys. Conf. Ser., 168, 341 (2001).
28. J. R. Taylor, An Introduction to Error Analysis, 2nd ed., p. 170, University Science Books, Sausalito, CA (1997).
29. S. J. Schneider, Engineered Materials Handbook, ASM International, Metals Park, OH (1991).
30. K. B. Albaugh, Mater. Lett., 4, 465 (1986).
31. J. A. Plaza, E. González, J. Esteve, M. M. Visser, D. T. Wang, and A. Hanneborg, Electrochem. Solid-State Lett., 3, 392 (2000).
32. M. M. Visser, J. A. Plaza, D. T. Wang, and A. B. Hanneborg, J. Micromech. Microeng., 11, N1 (2001).
33. C. M. Lepienski, J. A. Giacometti, F. L. Leal Ferreira, Jr., and C. A. Achete, J. Non-Cryst. Solids, 159, 204 (1993).
34. R. H. Doremus, Glass Science, 2nd ed., p. 263, John Wiley & Sons Inc., New York (1994).
35. A. T. J. van Helvoort, K. M. Knowles, and J. A. Fernie, J. Am. Ceram. Soc., In press.
36. I. P. M. Sutton, J. Am. Ceram. Soc., 47, 188 (1964).
37. T. G. Alley, S. R. J. Brueck, and R. A. Myers, J. Non-Cryst. Solids, 242, 165 (1998).