Development of coaxial shield via in silicon carrier for high frequency application

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2006, Pages 825-830

  Ho, Soon Wee ^a   Rao, Vempati Srinivasa ^a   Khan, Oratti Kalandar Navas ^a   Yoon, Seung Uk ^a   Kripesh, Vaidyanathan ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOBILE ELECTRONIC EQUIPMENT; AUTOMOBILE PARTS AND EQUIPMENT; CELLULAR RADIO SYSTEMS; CHIP SCALE PACKAGES; CIVIL AVIATION; CROSSTALK; ELECTRONICS PACKAGING; INTERNET PROTOCOLS; LITHOGRAPHY; NONMETALS; OPTICAL DESIGN; PHOTORESISTS; SIGNAL PROCESSING; SILICON; SILICON WAFERS; SUBSTRATES; SYSTEMS ANALYSIS; TECHNOLOGY; VEHICLE TRANSMISSIONS;

ELECTRICAL MODELING; EMERGING TECHNOLOGIES; FABRICATION PROCESSES; HIGH FREQUENCIES; HIGH-FREQUENCY APPLICATIONS; KEY TECHNOLOGIES; LOW RESISTIVITY; NEGATIVE TONES; OPTIMUM PERFORMANCE; PACKAGING TECHNOLOGIES; RF PERFORMANCE; SIGNAL ATTENUATION; SILICON CARRIERS; SILICON SUBSTRATES; SU-8 PHOTORESISTS; SUBSTRATE CROSS-TALK; SYSTEM DESIGNS; SYSTEM-IN-PACKAGE; TEST VEHICLES; THROUGH-WAFER INTERCONNECTS; TRANSMISSION COEFFICIENTS;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 50249151500     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2006.342819     Document Type: Conference Paper

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