Investigation of the formation of undercut during the fabrication of silicon microchannels by electrochemical etching

3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS

Volumn , Issue , 2008, Pages 74-77

  Lin, Jilei ^b   Chen, Xiaoming ^b   Xu, Shaohui ^b   Xin, Peisheng ^b   Wang, Lianwei ^a,b,c  

^a IEEE

^b EAST CHINA NORMAL UNIVERSITY   (China)

^c STATE KEY LABORATORY OF TRANSDUCER TECHNOLOGY   (China)

Author keywords

HF concentration; High aspect ratio; Microchannel; Undercut

Indexed keywords

ASPECT RATIO; CONCENTRATION (PROCESS); CURRENT DENSITY; ETCHING; HYDROFLUORIC ACID; IMAGE STORAGE TUBES; MICROCHANNELS; NONMETALS; OPTICAL DESIGN; PHOTORESISTS; POROUS SILICON; SEPARATION; SILICON;

HF CONCENTRATION; HF-BASED ELECTROLYTES; HIGH ASPECT RATIO; INTERNATIONAL CONFERENCES; LIGHT DETECTION; MICRO CHANNEL STRUCTURE; MICRO-CHANNEL PLATES; MICROCHANNEL; MOLECULAR SYSTEMS; NEW PROCESSES; NIGHT VISION; NUMEROUS APPLICATIONS; POROUS SILICON FORMATION; SILICON MICROCHANNELS; SINGLE-STEP; UNDERCUT;

ELECTROCHEMICAL ETCHING;

EID: 50249129437     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/NEMS.2008.4484289     Document Type: Conference Paper

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