An embedded device technology based on a molded reconfigured wafer

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 547-551

  Brunnbauer, M ^a   Furgut E ^a   Beer, G ^a   Meyer, T ^a   Hedler, H ^a   Belonio, J ^a   Nomura, E ^b   Kiuchi, K ^c   Kobayashi, K ^d  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b Nagase Chemtex Ltd   (Japan)

^c NITTO DENKO CORPORATION   (Japan)

^d Manufacturing Engineering Department   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COMPRESSION MOLDING; ELECTRIC NETWORK TOPOLOGY; ELECTRONICS PACKAGING; ENCAPSULATION; ROBUSTNESS (CONTROL SYSTEMS); SILICON WAFERS; THIN FILM DEVICES;

EMBEDDED DEVICE TECHNOLOGY; MOLDED RECONFIGURED WAFER; SILICON DICE; THIN-FILM INTERCONNECTS;

EMBEDDED SYSTEMS;

EID: 33845571094     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645702     Document Type: Conference Paper

References (4)

1. see http://public.itrs.net
2. J.-C. Souriau et al., "Wafer Level Processing of 3D System in Package for RF and Data Applications", 55th Electronic Components and Technology Conf, Lake Buena Vista, FL, June 2005, p. 356
3. S.N. Towle et al. "Bumpless Built-Up Layer Packaging", ASME International Mechanical Engineering Congress and Exposition, New York, NY, Nov. 2001
4. D. Komatsu and T. Wakabayashi, "Trend of WLP Technology and Next Generation Packaging "WLP and EWLP", 5th International Workshop on Microelectronics Assembly and Packaging & Reverse Trade Show, Fukuoka, Japan, 15.-16. Sept. 2005