Wafer level packaging having bump-on-polymer structure

Microelectronics Reliability

Volumn 43, Issue 6, 2003, Pages 879-894

  Reche, John J H ^a   Kim, Deok Hoon ^a  

^a Flip Chip Division   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CAPACITANCE; DIELECTRIC MATERIALS; ELECTRONICS PACKAGING; TOUGHNESS;

WAFER LEVEL PACKAGING (WLP);

MICROELECTRONICS;

EID: 0038824190     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00058-1     Document Type: Conference Paper

References (67)

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