Integration of passive components in thin film multilayer MCM-D technology for wireless front-end applications

Asia-Pacific Microwave Conference Proceedings, APMC

Volumn , Issue , 2000, Pages 7-

  Pieters, P ^a   Vaesen, K ^a   Carchon, G ^a   Brebels, S ^a   de Raedt, W ^a   Beyne, E ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; MULTICHIP MODULES; MULTILAYERS; PASSIVE NETWORKS; THIN FILMS; WIRELESS TELECOMMUNICATION SYSTEMS;

PASSIVE COMPONENTS; THIN FILM MULTILAYERS; WIRELESS FRONT ENDS;

INTEGRATED CIRCUIT LAYOUT;

EID: 0034460671     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)