Thin film encapsulation of microstructures using sacrificial cf-polymem

TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2007, Pages 343-346

  Reuter, D ^a   Bertz, A ^a   Werner, T ^a   Nowack, M ^a   Gessner, T ^a,b  

^a CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

^b FRAUNHOFER IZM   (Germany)

Author keywords

CF polymer; HARMS; Thin film packaging; Wafer level packaging

Indexed keywords

ACTUATORS; ASPECT RATIO; CMOS INTEGRATED CIRCUITS; COMPOSITE MICROMECHANICS; ELECTROMECHANICAL DEVICES; ENCAPSULATION; MEMS; MICROELECTROMECHANICAL DEVICES; MICROSTRUCTURE; MICROSYSTEMS; OPTICAL DESIGN; PHOTORESISTS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SENSORS; STANDARDS; STRESSES; TECHNOLOGY; THICK FILMS; THIN FILM DEVICES; THIN FILMS; TRANSDUCERS;

CAPPING LAYER; CF-POLYMER; CHEMICAL VAPORS; DIE AREA; FABRICATION TECHNOLOGIES; FINITE ELEMENT ANALYSIS; HARMS; HIGH ASPECT RATIO; INTERFEROMETRIC MEASUREMENTS; INTERNATIONAL CONFERENCES; MECHANICAL STRESSING; MICRO-ELECTRO MECHANICAL SYSTEMS; PACKAGING PROCESSES; PICK AND PLACE; PRESSURE DIFFERENCES; SOLID-STATE SENSORS; SURFACE MICRO STRUCTURING; TEST STRUCTURES; THIN FILM PACKAGING; THIN-FILM ENCAPSULATION; WAFER-LEVEL PACKAGING;

FINITE ELEMENT METHOD;

EID: 50049118331     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2007.4300138     Document Type: Conference Paper

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