Non-linear finite element analysis for electronic packages subjected to combined hygroscopic and thermo-mechanical stresses

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 2, Issue , 2005, Pages 569-574

  Yoon, Samson ^a   Han, Bongtae ^a   Cho, Seungmin ^b   Jang, Chang Soo ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

HYGROSCOPIC DEFORMATION; PACKAGE DEFORMATIONS; THERMAL EXPANSION MISMATCHES; THERMOMECHANICAL STRESSES;

ELECTRONICS PACKAGING; HEAT TRANSFER; INTERFEROMETRY; STRESSES; THERMAL EXPANSION; THERMOMECHANICAL TREATMENT;

FINITE ELEMENT METHOD;

EID: 33847314702     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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