Frequency effect on thermal fatigue damage in Cu interconnects

Thin Solid Films

Volumn 515, Issue 6, 2007, Pages 3253-3258

  Park, Young Bae ^a,b   Mönig, Reiner ^a,c   Volkert, Cynthia A ^a,c  

^a MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

^b Andong National University   (South Korea)

^c KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

Alternating current; Fatigue; Frequency effect; Metal interconnect

Indexed keywords

FATIGUE OF MATERIALS; GRAIN BOUNDARIES; NATURAL FREQUENCIES; POLYCRYSTALLINE MATERIALS; SPUTTERING; SURFACE ROUGHNESS;

ALTERNATING CURRENT; FREQUENCY EFFECTS; METAL INTERCONNECTS; THERMAL FATIGUE DAMAGE;

COPPER COMPOUNDS;

EID: 33846331961     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2006.01.037     Document Type: Article

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