Thin layer laser bonding using spin-on-glass materials

Applied Surface Science

Volumn 254, Issue 21, 2008, Pages 6842-6848

  Kim, Joohan ^a   Kim, Hyangtae ^a   Lee, Jae Hoon ^b  

^a Seoul National University of Science and Technology   (South Korea)

^b Korea Institute of Machine and Materials   (South Korea)

Author keywords

Laser bonding; Micro device; Spin on glass

Indexed keywords

BIOCHIPS; CURING; FLAT PANEL DISPLAYS; GLASS; LASER BEAMS; LASER MATERIALS PROCESSING; MICROELECTRONICS; NEODYMIUM LASERS; SPIN GLASS; SUBSTRATES; YTTRIUM ALUMINUM GARNET;

BONDING PROCESS; FOCUSED LASER BEAMS; GLASS SUBSTRATES; LASER BONDING; MICRO-DEVICE; PROCESS CHARACTERISTICS; SPIN ON GLASS; TRANSPARENT MATERIAL;

GLASS BONDING;

EID: 49549089290     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2008.04.093     Document Type: Article

References (18)

1. Sethu P., and Mastrangelo C.H. Cast epoxy-based microfluidic systems and their application in biotechnology. Sensors Actuator B 98 (2004) 337-346
2. Talary M.S., Burt J.P.H., Rizvi N.H., Rumsby P.T., and Pethig R. Microfabrication of biofactory-on-a-chip devices using laser ablation technology. Proc. SPIE 3680 (1999) 572-580
3. Zugel S.A., Burke B.J., Regnier F.E., and Lytle F.E. Electrophoretically mediated microanalysis of leucine aminopeptidase using two-photon excited fluorescence detection on a microchip. Anal. Chem. 72 (2000) 5731-5735
4. Hsu T. Packaging design of microsystems and meso-scale devices. IEEE Trans. Adv. Packaging 23 4 (2000) 596-601
5. Butler J.T., and Bright V.M. An embedded overlay concept for microsystems packaging. IEEE Trans. Adv. Packaging 23 4 (2000) 617-622
6. Lugscheider E., Bobzin K., and Lake M.K. Deposition of solder for micro-joining on M.E.M.S. components by means of magnetron sputtering. Surf. Coat. Tech. 142-144 (2001) 813-816
7. Kim H.S., Park S.W., and Lee D.G. Reliable joining of the spring wire to polymer composite for the micro-multi-functional actuator of cellular phones. Compos. Struct. 76 (2006) 252-259
8. Niklaus F., Stemme G., Lu J.-Q., and Gutmann R.J. Adhesive wafer bonding. J. Appl. Phys. 99 031101 (2006) 1-28
9. Schmidt M.A. Wafer-to-wafer bonding for microstructure formation. Proc. IEEE 86 8 (1998) 1575-1585
10. Tsau C.H., Spearing S.M., and Schmidt M.A. Fabrication of wafer-level thermocompression bonds. J. Microelectromech. Syst. 11 6 (2002) 641-647
11. Lei K.F., Li W.J., Budraa N., and Mai J.D. Microwave bonding of polymer-based substrates for micro-nano fluidic applications. TRANSDUCERS 03, Solid-State Sensors, Actuators and Microsystems, 12th International Conference 2 (2003) 1335-1338
12. Potente H., Korte J., and Becker F. Laser transmission welding of thermoplastics: analysis of the heating Phase. J. Reinf. Plast. Comp. 18 (1999) 914-920
13. Quenzer H.J., Dell C., and Wagner B. Silicon-silicon anodic-bonding with intermediate glass layers using spin-on glasses. Proc. IEEE Micro Electro Mech. Syst. (1996) 272-276
14. Yamada A., Kawasaki T., and Kawashima M. SOI by wafer bonding with spin-on glass as Adhesive. Electron. Lett. 23 (1987) 39-40
15. Chaminade C., Fogarassy E., and Boisselier D. Diode laser soldering using a lead-free filler material for electronic packaging structures. Appl. Surf. Sci. 252 13 (2006) 4406-4410
16. Holmes A.S. Laser fabrication and assembly processes for MEMS. Proc. SPIE 4274 (2001) 297-306
17. Bardin F., Kloss S., Wang C., Moore A.J., and Jourdain A. Laser bonding of glass to silicon using polymer for microsystems packaging. J. Microelectromech. Syst. 16 3 (2007) 571-580
18. Park J., Zhu H., Zhao Z., Tseng A.A., and Chen T.P. Direct writing of spot and line bonds for microsystem packaging using transmission laser bonding technique. Mater. Manuf. Process. 22 (2007) 71-80