An embedded overlay concept for microsystems packaging

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 4, 2000, Pages 617-622

  Butler, Jeffrey T ^a,b   Bright, Victor M ^a,c  

^a IEEE   (United States)

^b AIR FORCE RESEARCH LABORATORY   (United States)

^c University of Colorado at Boulder   (United States)

Author keywords

Chip on flex; Microelectromechanical systems; Microsystems packaging

Indexed keywords

LASER ABLATION; MICROELECTROMECHANICAL DEVICES; MICROELECTRONIC PROCESSING; MICROOPTICS; MULTICHIP MODULES;

CHIP ON FLEX; MICROSYSTEMS PACKAGING; RADIOFREQUENCY DEVICES;

ELECTRONICS PACKAGING;

EID: 0034315241     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.883750     Document Type: Article

References (10)

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