Direct writing of spot and line bonds for microsystem packaging using transmission laser bonding technique

Materials and Manufacturing Processes

Volumn 22, Issue 1, 2007, Pages 71-80

  Park, Jong Seung ^a   Zhu, Han ^b   Zhao, Zhilong ^a   Tseng, Ampere A ^a   Chen, T P ^c  

^a Arizona State University   (United States)

^b TIANJIN UNIVERSITY   (China)

^c NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Bonding; Contact pressure; Direct writing; Laser; Line bond; MEMS; Microsystem; Packaging; Pyrex glass; Reliability; Silicon; Spot bond; Strength; Surface roughness; Transmission laser bonding

Indexed keywords

ATOMIC FORCE MICROSCOPY; LASER BEAM EFFECTS; MICROELECTROMECHANICAL DEVICES; SILICON; STRENGTH OF MATERIALS; SURFACE ROUGHNESS;

CONTACT PRESSURE; DIRECT WRITING; LINE BOND; MICROSYSTEMS; PYREX GLASS; SPOT BOND; TRANSMISSION LASER BONDING;

BONDING;

EID: 33845747234     PISSN: 10426914     EISSN: 15322475     Source Type: Journal    
DOI: 10.1080/10426910601015964     Document Type: Article

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