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Volumn 66, Issue 1-4, 2003, Pages 480-487

A study on the reproducibility of HSS STI-CMP process for ULSI applications

Author keywords

Chemical mechanical polishing (CMP); High selectivity slurry (HSS); Reliability; Reproducibility; Shallow trench isolation (STI)

Indexed keywords

ETCHING; OXIDATION; PROCESS CONTROL; SILICON NITRIDE; ULSI CIRCUITS;

EID: 0344059204     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(02)00931-0     Document Type: Conference Paper
Times cited : (11)

References (8)
  • 1
    • 0000227014 scopus 로고    scopus 로고
    • Shallow trench isolation for sub-0.25 μm IC technologies
    • S. Nag, A. Chatterjee, Shallow trench isolation for sub-0.25 μm IC technologies, Solid State Technol. (1997) 129.
    • (1997) Solid State Technol. , pp. 129
    • Nag, S.1    Chatterjee, A.2
  • 3
    • 0031173553 scopus 로고    scopus 로고
    • CMP dishing effects in shallow trench isolation
    • K. Smekalin, CMP dishing effects in shallow trench isolation, Solid State Technol. (1997) 187.
    • (1997) Solid State Technol. , pp. 187
    • Smekalin, K.1
  • 4
    • 0001596106 scopus 로고    scopus 로고
    • An optimized nitride residue phenomena of shallow trench isolation (STI) process by chemical mechanical polishing (CMP)
    • S.Y. Kim, C.I. Kim, E.G. Chang, Y.J. Seo, T.H. Kim, W.S. Lee, An optimized nitride residue phenomena of shallow trench isolation (STI) process by chemical mechanical polishing (CMP), IUMRS-ICEM (1998) 106.
    • (1998) IUMRS-ICEM , pp. 106
    • Kim, S.Y.1    Kim, C.I.2    Chang, E.G.3    Seo, Y.J.4    Kim, T.H.5    Lee, W.S.6
  • 5
    • 0345142287 scopus 로고    scopus 로고
    • A study of removal rate control of oxide CMP (chemical mechanical polishing) process
    • Y.J. Seo, C.B. Kim, S.Y. Kim, A study of removal rate control of oxide CMP (chemical mechanical polishing) process, Proc. CMP-MIC (2001) 527.
    • (2001) Proc. CMP-MIC , pp. 527
    • Seo, Y.J.1    Kim, C.B.2    Kim, S.Y.3
  • 6
    • 0036532411 scopus 로고    scopus 로고
    • Correlation analysis between pattern and non-pattern wafer for characterization of shallow trench isolation-chemical mechanical polishing (STI-CMP) process
    • Kim S.Y., Seo Y.J. Correlation analysis between pattern and non-pattern wafer for characterization of shallow trench isolation-chemical mechanical polishing (STI-CMP) process. Microelectron. Eng. 60:2002;357.
    • (2002) Microelectron. Eng. , vol.60 , pp. 357
    • Kim, S.Y.1    Seo, Y.J.2
  • 7
    • 0345573802 scopus 로고    scopus 로고
    • Global planarization of direct STI-CMP process using high selectivity slurry
    • C.B. Kim, S.Y. Kim, S.Y. Jeong, Y.J. Seo, Global planarization of direct STI-CMP process using high selectivity slurry, Proc. VMIC (2001) 222.
    • (2001) Proc. VMIC , pp. 222
    • Kim, C.B.1    Kim, S.Y.2    Jeong, S.Y.3    Seo, Y.J.4
  • 8
    • 0013061186 scopus 로고    scopus 로고
    • Planarization process and consumables development for shallow trench isolation
    • S.D. Hosali et al., Planarization process and consumables development for shallow trench isolation, Proc. CMP-MIC (1997) 52.
    • (1997) Proc. CMP-MIC , pp. 52
    • Hosali, S.D.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.