Surface chemical processes in chemical mechanical polishing relationship between silica material removal rate and the point of zero charge of the abrasive material

Journal of the Electrochemical Society

Volumn 149, Issue 12, 2002, Pages

  Osseo Asare, K ^a,b  

^a PENNSYLVANIA STATE UNIVERSITY   (United States)

^b Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; ADSORPTION; CHEMICAL BONDS; CHEMICAL MECHANICAL POLISHING; COMPLEXATION; DISSOLUTION; MATHEMATICAL MODELS; SURFACE TREATMENT; VISUALIZATION;

HYDROXYLS; POINT OF ZERO CHARGE; SURFACE CHEMICAL PROCESSES;

SILICA;

EID: 0036959409     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1516777     Document Type: Article

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