Grain growth and void formation in dielectric-encapsulated Cu thin films

Journal of Materials Research

Volumn 23, Issue 7, 2008, Pages 2033-2039

  Yao, B ^a   Sun, T ^a   Kumar, V ^b   Barmak, K ^b   Coffey, K R ^a  

^a UNIVERSITY OF CENTRAL FLORIDA   (United States)

^b CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; COPPER ALLOYS; GRAIN SIZE AND SHAPE; SILICON COMPOUNDS; THICK FILMS;

CU FILMS; CU THIN FILMS; VOID FORMATIONS;

GRAIN GROWTH;

EID: 48749084276     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2008.0254     Document Type: Article

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