A modified back-etch method for preparation of plan-view high-resolution transmission electron microscopy samples

Journal of Electron Microscopy

Volumn 55, Issue 4, 2006, Pages 209-214

  Yao, Bo ^a   Petrova, Rumyana V ^b   Vanfleet, Richard R ^c   Coffey, Kevin R ^a,b  

^a University of Central Florida   (United States)

^b UNIVERSITY OF CENTRAL FLORIDA   (United States)

^c Brigham Young University   (United States)

Author keywords

Back etch method; HRTEM; Sample preparation; Si; TEM; Thin films

Indexed keywords

ALCOHOL; ETCH′ METHACRYLIC ACID DERIVATIVE; NANOPARTICLE; PYROPHOSPHATE; SILICON DIOXIDE; UNCLASSIFIED DRUG;

ARTICLE; CHEMISTRY; METHODOLOGY; MICROTOMY; SURFACE PROPERTY; TRANSMISSION ELECTRON MICROSCOPY;

DIPHOSPHATES; ETHANOL; METHACRYLATES; MICROSCOPY, ELECTRON, TRANSMISSION; MICROTOMY; NANOPARTICLES; SILICON DIOXIDE; SURFACE PROPERTIES;

AMMONIUM HYDROXIDE; BINARY ALLOYS; ETCHING; FILM PREPARATION; IRON ALLOYS; NANOPARTICLES; PLATINUM ALLOYS; SILICA; SILICON WAFERS; THIN FILMS;

BACK ETCHING; BACK-ETCH METHOD; HIGH-RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; SAMPLE PREPARATION; SI; SI WAFER; TEM; THIN-FILMS; THINNINGS; WAFER SUBSTRATES;

HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY;

EID: 33846210689     PISSN: 00220744     EISSN: 14779986     Source Type: Journal    
DOI: 10.1093/jmicro/dfl027     Document Type: Article

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