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Volumn 11, Issue 2-3, 2005, Pages 186-193

Laser beam soldering - A new assembly technology for microoptical systems

Author keywords

[No Author keywords available]

Indexed keywords

INDUSTRIAL APPLICATIONS; LASER BEAMS; MICROOPTICS; OPTICAL SYSTEMS; SOLDERING ALLOYS; STRESS ANALYSIS;

EID: 24044489943     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-004-0451-y     Document Type: Article
Times cited : (39)

References (7)
  • 1
    • 33645489210 scopus 로고    scopus 로고
    • Fluxless flip-chip for the photonic assembly: Comparison between evaporated SnPb(60/40) and AuSn(80/20) solder
    • VDI-Verlag GmbH
    • Kuhmann J et al. (1996) Fluxless flip-chip for the photonic assembly: comparison between evaporated SnPb(60/40) and AuSn(80/20) solder, Micro system Technologies 96,VDI-Verlag GmbH, pp.91-99
    • (1996) Micro System Technologies 96 , pp. 91-99
    • Kuhmann, J.1
  • 3
    • 33645486987 scopus 로고    scopus 로고
    • Au/Sn- Bumping von Laserchips, Flip- Chip-Technik und Selbstjustagegenauigkeit
    • Berlin
    • Pittroff W (1999) Au/Sn- Bumping von Laserchips, Flip- Chip-Technik und Selbstjustagegenauigkeit, Workshop für Photonische Integration und Aufbauten, Berlin
    • (1999) Workshop für Photonische Integration und Aufbauten
    • Pittroff, W.1
  • 6
    • 33645491302 scopus 로고    scopus 로고
    • Modular optic devices and optic interfaces
    • Düsseldorf
    • Stock A (2001) Modular optic devices and optic interfaces, Micro system technologies, Düsseldorf
    • (2001) Micro System Technologies
    • Stock, A.1
  • 7
    • 33645478522 scopus 로고    scopus 로고
    • PacTech (2003) URL: www.pactech.de; Single ball placement and laser reflow of solder balls of poly(3-methylthiophene) films. Verlag Shaker Publishing B.V., Maastricht, NL
    • (2003)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.