Microstructures of Sn-Ag-Cu lead-free soldered joints with diode-laser soldering

Zhongnan Daxue Xuebao (Ziran Kexue Ban)/Journal of Central South University (Science and Technology)

Volumn 37, Issue 2, 2006, Pages 229-234

  Han, Zong Jie ^a   Ju, Jin Long ^a   Xue, Song Bai ^a   Fang, Dian Song ^a   Wang, Jian Xin ^a   Yao, Li Hua ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Diode laser soldering; Lead free solder; Microstructure; Sn Ag Cu

Indexed keywords

COPPER ALLOYS; LASER BEAM WELDING; METALLOGRAPHIC MICROSTRUCTURE; SEMICONDUCTOR LASERS; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; TENSILE STRENGTH; TIN ALLOYS;

DIODE LASER SOLDERING; LEAD FREE SOLDER; SNAGCU ALLOYS; SPREADABILITY PROPERTIES;

SOLDERING;

EID: 33745750127     PISSN: 16727207     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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