Preparation and characterization on micron powder solder of Sn-Ag-Cu-RE

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 25, Issue 6, 2004, Pages 1-3

  Xue, Song Bai ^a   Yu, Sheng Lin ^b  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

^b CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION   (China)

Author keywords

Lead free solder; Liquidus; Sn Ag Cu alloy; Solidus

Indexed keywords

CHARACTERIZATION; COMPOSITION; COPPER ALLOYS; ENVIRONMENTAL PROTECTION; FABRICATION; MORPHOLOGY; PLASMA HEATING; POWDER METALLURGY; RARE EARTH ADDITIONS; RHENIUM; SCANNING ELECTRON MICROSCOPY; SILVER ALLOYS; TIN ALLOYS;

LEAD FREE SOLDER; LIQUIDUS; MICRON POWDER SOLDER; SN-AG-CU ALLOY; SOLIDUS;

BRAZING FILLER METALS;

EID: 18344396455     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (4)