Modeling & measurement of mutual coupling resulting from via structures within printed circuit boards

IEEE International Symposium on Electromagnetic Compatibility

Volumn , Issue , 2007, Pages

  Cornock, Leigh ^a   Dilworth, Ian ^a  

^a UNIVERSITY OF ESSEX   (United Kingdom)

Author keywords

3D PCB; Measurement; Modeling; Mutual coupling; Reflected impedance; Via

Indexed keywords

COPPER; ELECTRIC INVERTERS; ELECTROMAGNETIC COMPATIBILITY; ELECTROMAGNETIC WAVE EMISSION; ELECTROMAGNETISM; ELECTRONIC EQUIPMENT MANUFACTURE; INDUCTANCE; MAGNETIC FLUX; MAGNETIC MATERIALS; PLASTIC MOLDS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS;

3D PCB; MODELING; MUTUAL COUPLING; REFLECTED IMPEDANCE; VIA;

THREE DIMENSIONAL;

EID: 47849120494     PISSN: 10774076     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISEMC.2007.117     Document Type: Conference Paper

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