Modeling of multi-vias coupling for high speed interconnects

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2001, Pages 161-164

  Huang, Chung Chi ^a   Tsang, Leung ^a   Miller, Dennis ^a   Tripathi, Alok ^a  

^a University of Washington   (United States)

Author keywords

Coupling; High speed interconnect; Vias

Indexed keywords

APPROXIMATION THEORY; BOUNDARY CONDITIONS; FINITE DIFFERENCE METHOD; METHOD OF MOMENTS; PRINTED CIRCUIT DESIGN; TIME DOMAIN ANALYSIS;

HIGH SPEED INTERCONNECTS; MULTI-VIAS COUPLING;

INTERCONNECTION NETWORKS;

EID: 0035699303     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Full wave analysis of propagation characteristics of a through hole using the finite-difference time-domain method
2. New aspects in modeling and simulation of PCB/MCM vias
3. Transition properties of a vertical conductor connecting two microstrip lines at different planes
4. Quasi-static analysis of a microstrip via through a hole in a ground plane
5. Modeling and analysis of vias in multilayered integrated circuits
6. Coupled noise analysis for adjacent vias in multilayered digital circuits
7. Analysis and modeling of a coaxial-line/rectangular-waveguide junction
8. The admittance of cylindrical antennas driven from a coaxial line