Characterization of multiple-via interconnections for multilayer chip and module designs

IEEE Antennas and Propagation Society, AP-S International Symposium (Digest)

Volumn 1, Issue , 2001, Pages 338-341

  Chun Wen Paul Huang, ^a   Hammadi, S ^a   Lott, J ^a   Al Kuran, S ^a  

^a Anadigics Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EQUIVALENT CIRCUITS; HEAT SINKS; INTERCONNECTION NETWORKS; METHOD OF MOMENTS; PRINTED CIRCUIT BOARDS;

MICROWAVE CHIPS;

MULTICHIP MODULES;

EID: 0035156397     PISSN: 15223965     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Lumped-element models for multiple vias in stripline structure including prallelel plate noise
2. Agilent EEsof EDA
3. Analysis of microvia interconnects
4. Millimeter wave characteristics of flip-chip interconnects for multichip modules
5. Agilent EEsof EDA