Board level drop test analysis based on modal test and simulation

Journal of Electronic Packaging

Volumn 130, Issue 2, 2008, Pages 0210071-0210076

  Liu, Fang ^a   Meng, Guang ^a   Zhao, Mei ^a   Zhao, Junfeng ^b  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b INTEL CORPORATION   (China)

Author keywords

Drop test; FE simulation; Modal test; PCB

Indexed keywords

DAMPING; DROPS; FINITE ELEMENT METHOD; MODAL ANALYSIS; PRINTED CIRCUIT BOARDS;

BOARD LEVEL DROP TESTS; DAMPING PARAMETERS; DROP-TESTS; DYNAMICS SIMULATION; FE SIMULATION; MODAL SIMULATION; MODAL TEST; SIMULATION AND ANALYSIS; SOLDER JOINT RELIABILITY; TEST ANALYSIS;

ELASTIC MODULI;

EID: 47749104946     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2912212     Document Type: Article

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