Experimental modal analysis of PBGA printed circuit board assemblies

Proceedings of the Electronic Technology Conference, EPTC

Volumn , Issue , 1997, Pages 290-296

  Yang, Q J ^a   Lim, G H ^a   Lin, R M ^a   Yap, F F ^a   Pang, H L J ^a   Wang, Z P ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MODAL ANALYSIS; PRINTED CIRCUIT BOARDS;

PLASTIC BALL GRID ARRAYS (PBGA);

ELECTRONICS PACKAGING;

EID: 0031317001     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)