Improvement of JEDEC drop test in SJR qualification through alternative test board design

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 946-950

  Zhao, Junfeng ^a   Liu, Fang ^b   Zhou, Xin ^b   Zhou, Haiting ^b   Jing, Jianping ^b   Zhao, Mei ^b  

^a INTEL CORPORATION   (China)

^b SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

MOBILE PHONES; PERSONAL DIGITAL ASSISTANTS; SEMICONDUCTOR MATERIALS; STATISTICAL METHODS;

DROP IMPACT; JEDEC DROP TEST; PACKAGE COMPONENT LAYOUT; SOLDER JOINT RELIABILITY (SJR);

SOLDERED JOINTS;

EID: 35348871879     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373910     Document Type: Conference Paper

References (6)

1. JEDEC Standard JESD22-B111, Board level drop test method of components for handheld electronic products, 2003.
2. Tee, TY, Ng, HS, Lim, CT, Pek, E and Zhong Z, "Impact life prediction modeling of TFBGA packages under board level drop test," Microelectronics Reliability, Vol. 44, 1131-1142.
3. Zhao, J.F. and Gamer, L.J. "Mechanical modeling and analysis of board level drop test of electronic package." Proc 56th Electronic Components and Technology Conf. USA: San Diego, 2006, pp. 436-442.
4. Tang Yan Tee, Jing-en Luan, and Hun Shen Ng, "Development and Application of Innovational Drop Impact Modeling Techniques," Proc 55th Electronic Components and Technology Conf, 31 May-3 June 2005 pp. 504- 512.
5. Liping Zhu, Marcinkiewicz, W., "Drop impact reliability analysis of CSP packages at board and product levels through modeling approaches," IEEE Trans-CPMT-A, Vol. 28, No. 3 (2005), pp. 449-456.
6. ABAQUS 6.6 User's Manual. ABAOUS. Inc. 2006.