Enhancement of light reflectance and thermal stability in Ag-Cu alloy contacts on p -type GaN

Applied Physics Letters

Volumn 93, Issue 1, 2008, Pages

  Son, Jun Ho ^a   Jung, Gwan Ho ^a   Lee, Jong Lam ^a  

^a Pohang University of Science and Technology (POSTECH)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AGGLOMERATION; ALLOYS; ANNEALING; COPPER; COPPER ALLOYS; CRYSTAL GROWTH; GALLIUM ALLOYS; GALLIUM NITRIDE; GRAIN BOUNDARIES; INJECTION (OIL WELLS); OHMIC CONTACTS; REFLECTION; SCHOTTKY BARRIER DIODES; SEMICONDUCTING GALLIUM; SILVER; SOLID SOLUTIONS; SUPERCONDUCTING TAPES; SYSTEM STABILITY; THERMODYNAMIC STABILITY;

AG CU ALLOYS; AIR AMBIENT; AMERICAN INSTITUTE OF PHYSICS (AIP); CONTACT RESISTIVITIES; CU OXIDE; HOLE INJECTIONS; LIGHT REFLECTANCE; P TYPE GAN; PRECIPITATION (METALLOGRAPHY); SCHOTTKY-BARRIER HEIGHT (SBH); THERMAL STABILITY;

SILVER ALLOYS;

EID: 47249132017     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2956417     Document Type: Article

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