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Volumn 90, Issue 16, 2007, Pages

Formation process of high reflective Ni/Ag/Au Ohmic contact for GaN flip-chip light-emitting diodes

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; GALLIUM NITRIDE; METALLIZING; MULTILAYERS; NICKEL; OHMIC CONTACTS; SECONDARY ION MASS SPECTROMETRY;

EID: 34247394221     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2730734     Document Type: Article
Times cited : (35)

References (14)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.