Effects of reflow conditions on the formation of Au-Ni-Sn compounds at the interface of Au-Pb-Sn and Au-Sn solder joints with Ni substrate

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 161-167

  Kinyanjui, Robert K ^a   Zribi, Anis ^a   Cotts, Eric J ^a  

^a BINGHAMTON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; FLOW MEASUREMENT; GOLD COMPOUNDS; INTERFACES (MATERIALS); INTERMETALLICS; METALLIZING; NICKEL; SOLDERED JOINTS; SUBSTRATES;

REFLOW CONDITIONS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0036287485     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)

1. Getting ready-for lead-free solders
2. Lead-free alloys
3. Growth of a Au-Ni-Sn intermetallic Compound on the solder-substrate interface after aging
4. Solder metallization interdiffusion in microelectronic interconnects
5. Microstructure, joint strength and failure mechanism of Sn-Ag, Sn-Ag-Cu versus Sn-Pb-Ag solders in BGA packages
6. Diffusion controlled reactions in Au/Pb-Sn solder system
7. Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders
8. 4 intermetallic layer in Pb-Sn solder joints reflowed on Au/Ni metallization
9. 4 in solder joints of ball-grid-array packages