메뉴 건너뛰기




Volumn 45, Issue 18-19, 2008, Pages 5152-5164

Thermo-elastic behavior of a polymeric layer bonded between rigid interfaces

Author keywords

Actuators; Artificial muscle; MEMS; Polymers; Thermal effects in solids; Thermo elasticity

Indexed keywords

ASPECT RATIO; CHEMICALS; DIMENSIONAL STABILITY; ELASTICITY; PAINTING; POISSON RATIO; POLYMERS; SOLUTIONS; THERMOELASTICITY;

EID: 47049122189     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijsolstr.2008.05.016     Document Type: Article
Times cited : (5)

References (25)
  • 2
    • 0026204085 scopus 로고
    • Analysis of infinite-strip shaped base isolator with elastomer bulk compression
    • Chalhoub M.S., and Kelly J.M. Analysis of infinite-strip shaped base isolator with elastomer bulk compression. Journal of Engineering Mechanics 117 8 (1991) 1791-1805
    • (1991) Journal of Engineering Mechanics , vol.117 , Issue.8 , pp. 1791-1805
    • Chalhoub, M.S.1    Kelly, J.M.2
  • 4
    • 0037113337 scopus 로고    scopus 로고
    • The characterization of thermal and elastic constant for an epoxy photoresist SU8 coating
    • Feng R., and Farris R.J. The characterization of thermal and elastic constant for an epoxy photoresist SU8 coating. Journal Materials Science 27 (2002) 4793-4799
    • (2002) Journal Materials Science , vol.27 , pp. 4793-4799
    • Feng, R.1    Farris, R.J.2
  • 6
    • 0028460687 scopus 로고
    • Compression of rubber blocks
    • Gent A.N. Compression of rubber blocks. Rubber Chemistry and Technology 67 3 (1994) 549-558
    • (1994) Rubber Chemistry and Technology , vol.67 , Issue.3 , pp. 549-558
    • Gent, A.N.1
  • 7
    • 33744726615 scopus 로고
    • Interfacial stresses for bonded rubber blocks in compression and shear
    • Gent A.N., Henry R.L., and Roxbury M.L. Interfacial stresses for bonded rubber blocks in compression and shear. Journal of Applied Mechanics 15 12 (1974) 47-52
    • (1974) Journal of Applied Mechanics , vol.15 , Issue.12 , pp. 47-52
    • Gent, A.N.1    Henry, R.L.2    Roxbury, M.L.3
  • 8
    • 0030166119 scopus 로고    scopus 로고
    • Determination of an effective coefficient of thermal expansion of electronic packaging components: a whole-field approach
    • Han B., and Guo Y. Determination of an effective coefficient of thermal expansion of electronic packaging components: a whole-field approach. IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A 19 2 (1996) 240-247
    • (1996) IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A , vol.19 , Issue.2 , pp. 240-247
    • Han, B.1    Guo, Y.2
  • 9
    • 0024305053 scopus 로고
    • Compression stiffness of bonded square layers of nearly incompressible material
    • Koh C.G., and Kelly J.M. Compression stiffness of bonded square layers of nearly incompressible material. Engineering Structures 11 1 (1989) 9-15
    • (1989) Engineering Structures , vol.11 , Issue.1 , pp. 9-15
    • Koh, C.G.1    Kelly, J.M.2
  • 11
    • 49149111550 scopus 로고    scopus 로고
    • Lau, G.K., Goosen, J.F.L., van Keulen, F., Chu Duc, T., Sarro, P.M., 2008. Polymeric thermal micro-actuator with embedded silicon skeleton: Part I design and analysis, J. Microelectromech. Syst. in press, doi:10.1109/JMEMS.2008.924842.
    • Lau, G.K., Goosen, J.F.L., van Keulen, F., Chu Duc, T., Sarro, P.M., 2008. Polymeric thermal micro-actuator with embedded silicon skeleton: Part I design and analysis, J. Microelectromech. Syst. in press, doi:10.1109/JMEMS.2008.924842.
  • 12
    • 49149112353 scopus 로고    scopus 로고
    • Lau, G.K., Goosen, J.F.L., van Keulen, F., Chu Duc, T., Sarro, P.M., 2006a. Electro-thermally activated polymeric stack for linear in-plane actuation. In: Proceedings of the 5th IEEE Conference on Sensors. Daegu, Korea, pp. 538-541.
    • Lau, G.K., Goosen, J.F.L., van Keulen, F., Chu Duc, T., Sarro, P.M., 2006a. Electro-thermally activated polymeric stack for linear in-plane actuation. In: Proceedings of the 5th IEEE Conference on Sensors. Daegu, Korea, pp. 538-541.
  • 15
    • 0018286678 scopus 로고
    • Compression module for blocks of soft elastic material bonded to rigid end plates
    • Lindley P.B. Compression module for blocks of soft elastic material bonded to rigid end plates. Journal of Strain Analysis 14 (1979) 11-16
    • (1979) Journal of Strain Analysis , vol.14 , pp. 11-16
    • Lindley, P.B.1
  • 17
    • 0031647457 scopus 로고    scopus 로고
    • Electrostriction of polymer dielectrics with compliant electrodes as a means of actuation
    • Pelrine R.E., Kornbluh R.D., and Joseph J.P. Electrostriction of polymer dielectrics with compliant electrodes as a means of actuation. Sensors and Actuators A: Physical 64 1 (1998) 77-85
    • (1998) Sensors and Actuators A: Physical , vol.64 , Issue.1 , pp. 77-85
    • Pelrine, R.E.1    Kornbluh, R.D.2    Joseph, J.P.3
  • 18
    • 0001424622 scopus 로고    scopus 로고
    • Composites with extremal thermal expansion coefficients
    • Sigmund O., and Torquato S. Composites with extremal thermal expansion coefficients. Applied Physics Letters 69 21 (1996) 3203-3205
    • (1996) Applied Physics Letters , vol.69 , Issue.21 , pp. 3203-3205
    • Sigmund, O.1    Torquato, S.2
  • 19
    • 0031169474 scopus 로고    scopus 로고
    • Design of materials with extreme thermal expansion using a three-phase topology optimization method
    • Sigmund O., and Torquato S. Design of materials with extreme thermal expansion using a three-phase topology optimization method. Journal of the Mechanics and Physics of Solids 45 6 (1997) 1037-1067
    • (1997) Journal of the Mechanics and Physics of Solids , vol.45 , Issue.6 , pp. 1037-1067
    • Sigmund, O.1    Torquato, S.2
  • 21
    • 0024734854 scopus 로고
    • Interfacial stresses in bimetal thermostats
    • Suhir E. Interfacial stresses in bimetal thermostats. ASME Journal of Applied Mechanics 56 3 (1989) 595-600
    • (1989) ASME Journal of Applied Mechanics , vol.56 , Issue.3 , pp. 595-600
    • Suhir, E.1
  • 22
    • 0032132046 scopus 로고    scopus 로고
    • Compressive stiffness of elastic layers bonded between rigid plates
    • Tsai H.C., and Lee C.C. Compressive stiffness of elastic layers bonded between rigid plates. International Journal of Solids and Structures 35 23 (1998) 3053-3069
    • (1998) International Journal of Solids and Structures , vol.35 , Issue.23 , pp. 3053-3069
    • Tsai, H.C.1    Lee, C.C.2
  • 23
    • 0033149312 scopus 로고    scopus 로고
    • Tilting stiffness of elastic layers bonded between rigid plates
    • Tsai H.C., and Lee C.C. Tilting stiffness of elastic layers bonded between rigid plates. International Journal of Solids and Structures 36 17 (1999) 2485-2505
    • (1999) International Journal of Solids and Structures , vol.36 , Issue.17 , pp. 2485-2505
    • Tsai, H.C.1    Lee, C.C.2
  • 24
    • 4444359265 scopus 로고    scopus 로고
    • A note on Suhir's solution of thermal stresses for a die-substrate assembly
    • Tsai M.Y., Hsu C.H., and Han C.N. A note on Suhir's solution of thermal stresses for a die-substrate assembly. Journal of Electronic Packaging 126 (2004) 115
    • (2004) Journal of Electronic Packaging , vol.126 , pp. 115
    • Tsai, M.Y.1    Hsu, C.H.2    Han, C.N.3
  • 25
    • 0027663573 scopus 로고
    • Thermal-mechanical strain characterization for printed wiring boards
    • Wu T., Guo Y., and Chen W. Thermal-mechanical strain characterization for printed wiring boards. IBM Journal of Research and Development 37 5 (1993) 621-634
    • (1993) IBM Journal of Research and Development , vol.37 , Issue.5 , pp. 621-634
    • Wu, T.1    Guo, Y.2    Chen, W.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.