The characterization of thermal and elastic constants for an epoxy photoresist SU8 coating

Journal of Materials Science

Volumn 37, Issue 22, 2002, Pages 4793-4799

  Feng, R ^a   Farris, R J ^a  

^a UNIVERSITY OF MASSACHUSETTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; DIFFERENTIAL SCANNING CALORIMETRY; ELASTIC MODULI; EPOXY RESINS; HOLOGRAPHY; MECHANICAL VARIABLES MEASUREMENT; PHOTORESISTS; POISSON RATIO; TENSILE TESTING; THERMAL EXPANSION; THERMOGRAVIMETRIC ANALYSIS;

HIGH PRESSURE GAS DILATOMETRY MEASUREMENT; THERMAL CALORIMETRIC PROPERTIES; THERMAL EXPANSION COEFFICIENT; VIBRATION HOLOGRAPHY TESTS; VOLUMETRIC PROPERTIES;

ORGANIC COATINGS;

EID: 0037113337     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1020862129948     Document Type: Article

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