Characterization of self-formed Ti-rich interface layers in Cu(Ti)/low-k samples

Journal of Electronic Materials

Volumn 37, Issue 8, 2008, Pages 1148-1157

  Kohama, Kazuyuki ^a   Ito, Kazuhiro ^a   Tsukimoto, Susumu ^a   Mori, Kenichi ^b   Maekawa, Kazuyoshi ^b   Murakami, Masanori ^a,c  

^a KYOTO UNIVERSITY   (Japan)

^b RENESAS TECHNOLOGY CORP   (Japan)

^c Ritsumeikan Trust   (Japan)

Author keywords

Barrier layer; Cu(Ti) alloy film; Low k films; Reaction; Self formation

Indexed keywords

DIFFUSION BARRIER LAYER (DBL); INTERFACE LAYERS (IL);

COPPER ALLOYS; SILICON COMPOUNDS;

COPPER;

EID: 46749136743     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0482-8     Document Type: Article

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