Pad surface analysis and conditioning effects: Implications on process design, break-in response and next generation pad and conditioning platforms

ICPT 2007 - International Conference on Planarization/CMP Technology, Proceedings

Volumn , Issue , 2007, Pages 25-29

  Lawing, Andrew Scott ^a   Juras, Chris ^a  

^a ROHM AND HAAS COMPANY   (United States)

Author keywords

Break in; Chemical mechanical Polishing; CMP; Native porosity; Pad conditioning; Pad height probability distribution function; Pad surface analysis; Pad texture; Pdf; Process effects

Indexed keywords

DISTRIBUTION FUNCTIONS; POLISHING; POROSITY; SURFACE ANALYSIS; TEXTURES;

CONDITIONING EFFECTS; POLISHING PADS; POLISHING PROCESSS; STATISTICAL REPRESENTATIONS; SURFACE-TEXTURING; TEXTURAL COMPONENTS; TEXTURAL EVOLUTION; THREE COMPONENT;

DESIGN;

EID: 84964520804     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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6. L. Borucki, et al., J. Eng. Math., 50, (1), 1 (2004)