Grain boundary diffusion in consolidated nanomaterials. Stress effect on grain boundary diffusion

Journal of Metastable and Nanocrystalline Materials

Volumn 19, Issue , 2004, Pages 69-106

  Bokstein, B ^a   Ivanov, M ^b   Kolobov, Yu ^b   Ostrovsky, A ^c  

^a NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGY MISIS   (Russian Federation)

^b TOMSK STATE UNIVERSITY   (Russian Federation)

^c NEW YORK UNIVERSITY   (United States)

Author keywords

Creep Activation Effect; Grain Boundary Diffusion; Nanoclusters; Nanograin Boundaries; Nanomaterials; Severe Plastic Deformation; Stress Effect; Thin Films

Indexed keywords

DIFFUSION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MATHEMATICAL MODELS; PLASTIC DEFORMATION; STRESSES; THIN FILMS;

CREEP ACTIVATION EFFECTS; GRAIN BOUNDARY DIFFUSION; METALLIC NANOMATERIALS; POLYCRYSTALLINE FILMS;

NANOSTRUCTURED MATERIALS;

EID: 4644370552     PISSN: 14226375     EISSN: None     Source Type: Journal    
DOI: 10.4028/www.scientific.net/JMNM.19.69     Document Type: Review

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