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Volumn 129-130, Issue , 1996, Pages 9-30

Why diffusion and stresses?

Author keywords

Diffusion induced stress; Growth kinetics of reaction layers; Interdiffusion

Indexed keywords


EID: 3743125574     PISSN: 10120386     EISSN: 16629507     Source Type: Journal    
DOI: 10.4028/www.scientific.net/ddf.129-130.9     Document Type: Article
Times cited : (25)

References (27)
  • 10
  • 11
    • 3142621707 scopus 로고
    • Proc. of "Thin Films: Stresses and Mechanical Properties"
    • Eds.: S.P. Baker, P. Borgensen, P.H. Townsend and C. A. Ross
    • F. L. Yang, W. C. Shin and A.L. Greer, Proc. of "Thin Films: Stresses and Mechanical Properties" (Fall Meeeting of MRS 1944; Eds.: S.P. Baker, P. Borgensen, P.H. Townsend and C. A. Ross)
    • (1944) Fall Meeeting of MRS
    • Yang, F.L.1    Shin, W.C.2    Greer, A.L.3
  • 19
    • 3142511450 scopus 로고
    • ed. J. Lendvai, Trans Tech Publ.
    • D.L. Beke, Key Engineering Materials, (ed. J. Lendvai, Trans Tech Publ.) 103, 51 (1995)
    • (1995) Key Engineering Materials , vol.103 , pp. 51
    • Beke, D.L.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.