Grain boundary diffusion in thin films under stress field in kinetic regime "C"

Defect and Diffusion Forum

Volumn 156, Issue , 1998, Pages 249-254

  Ostrovsky, A ^a  

^a NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGY MISIS   (Russian Federation)

Author keywords

Diffusion; Grain boundary; Stress; Thin films

Indexed keywords

EID: 0006275816     PISSN: 10120386     EISSN: 16629507     Source Type: Journal    
DOI: 10.4028/www.scientific.net/ddf.156.249     Document Type: Article

References (14)

1. J.Philibert, Diffusion and Mass Transport in Solids, Édition de Physique (1991).
2. K.L. Chopra, Thin Film Phenomena, McGraw-Hill, NY, (1969).
3. N. Balandina, B. Bokstem, A. Ostrovsky et al., Defect and Diffusion Forum, 129-130 (1996), p. 151.
4. J.C.M.Hwang, R.W. Balluffi, Journal of Applied Physics, 50(3) (1979), p. 1339.
5. P.H. Holloway, G.E.McGuire, Journal of Electrochem.Soc.,125(12) (1978), p. 2070.
6. L.G.Harrison, Trans. Faraday Soc. 57 (1961), p. 1191.
7. B.S. Bokstein, Diffusion in Metals, Moscow, Metallurgia, 1978 (in russian).
8. H.Mehrer, Defect and Diffusion Forum, 129-130 (1996), p. 57.
9. J.C.Fisher, J. Appl. Phys., 22 (1951), p. 74
10. K.N.Tu, J.Mayer, Feildman, Material Science: thin film technology. McGraw-Hill, NY, (1992).
11. N.A.Gjostein, Diffusion, edited by H.I. Aaronson, American Society for Metals, Metals Park, Ohio, (1973).
12. N.Balandina, B.Bokstein, A.Ostrovsky, this volume.
13. A.L.Peteline, B.S.Bokstein, Poverhnost', No 5 (1993), p. 31 (in Russian).
14. S.Danyluk, G.E.McGuire, K.M.Kollwad et. al., Thin Solid Films, 25 (1974), p. 483.