Grain boundary diffusion and mechanisms of creep of nanostructured metals

Interface Science

Volumn 10, Issue 1, 2002, Pages 31-36

  Kolobov, Yu R ^a   Grabovetskaya, G P ^a   Ivanov, K V ^a   Ivanov, M B ^a  

^a INSTITUTE OF STRENGTH PHYSICS AND MATERIALS SCIENCE   (Russian Federation)

Author keywords

Creep; Grain boundary diffusion; Nanostructured materials

Indexed keywords

ACTIVATION ENERGY; COPPER; CREEP; DIFFUSION; GRAIN BOUNDARIES; NICKEL; TEMPERATURE;

CREEP ACTIVATION ENERGY; GRAIN BOUNDARY DIFFUSION; NANOSTRUCTURED METAL;

NANOSTRUCTURED MATERIALS;

EID: 0036541181     PISSN: 09277056     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1015128928158     Document Type: Article

References (15)