Copper diffusion in nickel thin films under stresses in the kinetic regime "B"

Defect and Diffusion Forum

Volumn 156, Issue , 1998, Pages 181-190

  Balandina, N ^a   Bokstein, B ^a   Ostrovsky, A ^a  

^a NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGY MISIS   (Russian Federation)

Author keywords

Copper; Diffusion; Grain Boundary; Nickel; Secondary Ion Mass Spectrometry; Stress; Thin Film

Indexed keywords

EID: 0342922641     PISSN: 10120386     EISSN: 16629507     Source Type: Journal    
DOI: 10.4028/www.scientific.net/ddf.156.181     Document Type: Article

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