In-situ observation of transition between surface relief and wrinkling in thin film shape memory alloys

Journal of Nanoscience and Nanotechnology

Volumn 8, Issue 5, 2008, Pages 2588-2596

  Fu, Y Q ^a   Sanjabi, S ^b   Barber, Z H ^a   Huang, W M ^c   Cai, M ^d   Zhang, S ^c   Luo, J K ^a   Hewitt, A J ^a   Milne, W I ^a  

^a UNIVERSITY OF CAMBRIDGE   (United Kingdom)

^b TARBIAT MODARES UNIVERSITY   (Iran)

^c NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^d UNIVERSITY OF HOUSTON   (United States)

Author keywords

Relief; Shape memory; Surface morphology; Thin film; TiNiCu; Wrinkling

Indexed keywords

(1 1 0) SURFACE; (ABIOTIC AND BIOTIC) STRESS; AMORPHOUS MATRICES; AS-DEPOSITED; CRITICAL DIMENSION (CD); CRYSTALLIZATION TEMPERATURE (CT); FILM COMPOSITIONS; HIGH TEMPERATURE (HT); IN SITU OBSERVATIONS; IN-PLANE EXPANSION; MARTENSITE CRYSTALS; MARTENSITE PLATES; MORPHOLOGY CHANGES; MORPHOLOGY EVOLUTION; POSTANNEALING (PA); ROOM-TEMPERATURE (RT); SILICON (111) SUBSTRATES; SURFACE RELIEFS; SURFACE WRINKLING; THIN-FILM SHAPE MEMORY ALLOYS; TRANSITION (JEL CLASSIFICATIONS:E52 ,E41 ,E31); WRINKLING PATTERNS;

ALLOYS; AMORPHOUS FILMS; AMORPHOUS MATERIALS; ANNEALING; CRYSTALLIZATION; CRYSTALLOGRAPHY; GEOPHYSICAL PROSPECTING; LITHOGRAPHY; MARTENSITE; MARTENSITIC TRANSFORMATIONS; MOLECULAR BEAM EPITAXY; MORPHOLOGY; NANOCRYSTALLINE ALLOYS; PLATES (STRUCTURAL COMPONENTS); REAL TIME SYSTEMS; SOLIDS; SPUTTERING; STEEL ANALYSIS; STRESS RELIEF; TENSILE STRESS; THICK FILMS;

SURFACE MORPHOLOGY;

EID: 45849084284     PISSN: 15334880     EISSN: None     Source Type: Journal    
DOI: 10.1166/jnn.2008.630     Document Type: Conference Paper

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