Effect of composition on surface relief morphology in TiNiCu thin films

Surface and Coatings Technology

Volumn 201, Issue 12, 2007, Pages 5843-5849

  Cai, M ^a   Fu, Y Q ^b   Sanjabi, S ^b   Barber, Z H ^b   Dickinson, J T ^a  

^a WASHINGTON STATE UNIVERSITY   (United States)

^b UNIVERSITY OF CAMBRIDGE   (United Kingdom)

Author keywords

Crystallization; Martensitic transformation; Shape memory alloys; Surface relief

Indexed keywords

ANNEALING; COMPOSITION; CRYSTALLIZATION; DIFFERENTIAL SCANNING CALORIMETRY; ENERGY DISPERSIVE SPECTROSCOPY; MARTENSITIC TRANSFORMATIONS; MORPHOLOGY; SHAPE MEMORY EFFECT;

SURFACE RELIEF MORPHOLOGY;

THIN FILMS;

ANNEALING; COMPOSITION; CRYSTALLIZATION; DIFFERENTIAL SCANNING CALORIMETRY; ENERGY DISPERSIVE SPECTROSCOPY; MARTENSITIC TRANSFORMATIONS; MORPHOLOGY; SHAPE MEMORY EFFECT; THIN FILMS;

EID: 33846593498     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2006.10.033     Document Type: Article

References (23)

1. Fu Y.Q., Du H.J., Huang W.M., Zhang S., and Hu M. Sens. Actuators, A 112 (2004) 395
2. Wolf R.H., and Heuer A.H. J. Microelectromech. Sys. 4 (1995) 206
3. Fu Y., Huang W., Du H., Huang X., Tan J., and Gao X. Surf. Coat. Technol. 145 (2001) 107
4. Kahn H., Huff M.A., and Heuer A.H. J. Micromechanics Microengineering 8 (1998) 213
5. He Q., Huang W.M., Hong M.H., Wu M.J., Fu Y.Q., Chong T.C., Chellet F., and Du H.J. Smart Mater. Struc. 13 (2004) 977
6. Tabib-Azar M., Sutapun B., and Huff M. Sens. Actuators, A 77 (1999) 34
7. Lee H.J., Ni H., Wu D.T., and Ramirez A.G. Appl. Phys. Lett. 87 (2005) 114102
8. Lee H.J., and Ramirez A.G. Appl. Phys. Lett. 85 (2004) 1146
9. Chang L., and Grummon D.S. Philos. Mag., A 76 (1997) 163
10. Chang L., and Grummon D.S. Philos. Mag., A 76 (1997) 191
11. Chen J.Z., and Wu S.K. Thin Solid Films 339 (1999) 194
12. Chen J.Z., and Wu S.K. J. Non-Cryst. Solids 288 (2001) 159
13. Ni H., Lee H.J., and Ramirez A.G. J. Mater. Res. 20 (2005) 1728
14. Wang X., and Vlassak J.J. Scr. Mater. 54 (2006) 925
15. Hassdorf R., Feydt J., Pascal R., Thienhaus S., Boese M., Sterzl T., Winzek B., and Moske M. Mater. Trans., JIM 43 (2002) 933
16. Yoshida I., Monma D., Iino K., Otsuka K., Asai M., and Tsuzuki H. J. Alloys Compd. 355 (2003) 79
17. Miyazaki S., and Ishida A. Mater. Sci. Eng., A 273-275 (1999) 106
18. Tang W., Sandström R., Wei Z.G., and Miyazaki S. Metall. Mater. Trans., A 31 (2000) 2423
19. Ishida A., and Sato M. Acta Mater. 51 (2003) 5571
20. Krulevitch P., Lee A.P., Ramsey P.B., Trevino J.C., Hamilton J., and Northrup M.A. J. Microelectromech. Syst. 5 (1996) 270
21. Fu Y.Q., Du H.J., and Zhang S. Surf. Coat. Technol. 167 (2003) 120
22. Chen H.S. Acta Metall. 22 (1974) 897
23. Chen H.S., and Park B.K. Acta Metall. 21 (1973) 395