Mie-Grüneisen analysis of the molecular bonding states in silica which impact time-dependent dielectric breakdown

Microelectronics Reliability

Volumn 44, Issue 9-11 SPEC. ISS., 2004, Pages 1491-1496

  McPherson, J W ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC BREAKDOWN; DIPOLE-MOMENT; MOLECULAR BONDING STATES; SILICA-BASED DIELECTRICS;

ANNEALING; BOND STRENGTH (CHEMICAL); CHEMICAL BONDS; DEUTERIUM; DIELECTRIC MATERIALS; ELECTRODES; ELECTRON ENERGY LEVELS; QUANTUM THEORY; SILICA;

ELECTRIC BREAKDOWN;

EID: 4544334754     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.07.045     Document Type: Conference Paper

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