Interdiffusion, phase formation, and stress development in Cu-Pd thin-film diffusion couples: Interface thermodynamics and mechanisms

Journal of Applied Physics

Volumn 103, Issue 11, 2008, Pages

  Chakraborty, J ^a   Welzel, U ^a   Mittemeijer, E J ^a  

^a MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; COPPER ALLOYS; LITHOGRAPHY; MAGNETRON SPUTTERING; PALLADIUM; PHASE INTERFACES; SEMICONDUCTOR DOPING; SILICON; THIN FILM DEVICES;

AMORPHOUS SI; DC-MAGNETRON SPUTTERING; INDIVIDUAL (PSS 544-7); INTER-DIFFUSION; LAYER THICKNESSES; PHASE FORMATIONS; SILICON (111) SUBSTRATES; STRESS DEVELOPMENT; THIN-FILM DIFFUSION;

AMORPHOUS SILICON;

EID: 45149122002     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2938079     Document Type: Article

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