Coefficients of thermal expansion of thin metal films investigated by non-ambient X-ray diffraction stress analysis

Surface and Coatings Technology

Volumn 202, Issue 11, 2008, Pages 2306-2309

  Kuru, Y ^a   Wohlschlogel M ^a   Welzel, U ^a   Mittemeijer, E J ^a  

^a MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

Author keywords

Coefficient of thermal expansion; Nanocrystalline materials; Thin film; X ray diffraction

Indexed keywords

ANNEALING; COPPER; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; NANOCRYSTALLINE MATERIALS; NICKEL; PALLADIUM; STRESSES; THERMAL EXPANSION;

CRYSTALLINE IMPERFECTION; THIN METAL FILM;

THIN FILMS;

ANNEALING; COPPER; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; NANOCRYSTALLINE MATERIALS; NICKEL; PALLADIUM; STRESSES; THERMAL EXPANSION; THIN FILMS;

EID: 38949131875     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2007.08.002     Document Type: Article

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