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Surface and Coatings Technology

Volumn 202, Issue 19, 2008, Pages 4861-4867

Optimisation of process parameters for electroless plating of Co-W-P capping layers from an alkali-metal-free bath

(5) Kim, Tae Ho a Dulal, S M S I b Park, Chang Han a Chae, Heeyeop c Kim, Chang Koo a

a Ajou University (South Korea)

b UNIVERSITY OF RAJSHAHI (Bangladesh)

c Sungkyunkwan University (South Korea)

Author keywords

Capping layers; Co W P thin films; Electroless deposition; Microelectronic devices; Microstructure

Indexed keywords

CRYSTAL ORIENTATION; GRAIN SIZE AND SHAPE; PH EFFECTS; SILICON WAFERS; STRUCTURE (COMPOSITION); THERMAL EFFECTS; THIN FILMS;

ALKALI-METAL-FREE BATH; MICROSTRUCTURAL ANALYSIS;

ELECTROLESS PLATING;

CRYSTAL ORIENTATION; ELECTROLESS PLATING; GRAIN SIZE AND SHAPE; PH EFFECTS; SILICON WAFERS; STRUCTURE (COMPOSITION); THERMAL EFFECTS; THIN FILMS;

EID: 44649083046 PISSN: 02578972 EISSN: None Source Type: Journal
DOI: 10.1016/j.surfcoat.2008.04.077 Document Type: Article

Times cited : (14)

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