An efficient and flexible modeling for power/ground planes

Electrical Performance of Electronic Packaging, EPEP

Volumn , Issue , 2006, Pages 83-86

  Wu, Kai Bin ^a   Shiue, Guang Hwa ^a   Guo, Wei Da ^a   Lin, Chíen Min ^b   Wu, Ruey Beei ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; LUMPED PARAMETER NETWORKS;

ELECTRICAL PERFORMANCES; ELECTRONIC PACKAGING; FLEXIBLE MODELING; GROUND PLANE (GP); LUMPED CIRCUITS; MODEL NETWORK; MULTILAYER DESIGNS; TRIANGULAR MESHES;

SPICE;

EID: 50049104611     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2006.321197     Document Type: Conference Paper

References (4)

1. T. H. Hubing, J. L. Drewniak, T. P. Van Doren, and D. M. Hockanson, "Power Bus Decoupling on Multilayer Printed Circuit Boards," IEEE Trans. Electromagn. Compat., vol. 37, pp. 155-166, May. 1995.
2. L. D. Smith. R. Anderson, and T. Roy, "Power Plane SPICE Models and Simulated Performance for Materials and Geometries," IEEE Trans. Adv Packag., vol. 24, pp. 277-287, Aug. 2001.
3. D. M. Pozar, Microwave Engineering, 2nd. Ed., John Wiley & Sons, inc., 1998, Ch. 1.
4. IE3D, Zeland Software, Inc., Version 9.1(www.zeland.com.).