Accurate analysis of multi-layered signal and power distributions using the fringe RLGC models

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2004, Pages 103-106

  Huang, Ching Chao ^a   Luk, Clement ^a  

^a Optimal Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BORADBAND ANALYSIS; CANONICAL GEOMETRIES; DECOUPLING CAPACITORS; MULTI-LAYERED SIGNALS;

CAPACITANCE; CAPACITORS; ELECTRIC CONDUCTANCE; ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; INDUCTANCE; INTEGRATED CIRCUITS; MATRIX ALGEBRA; MICROPROCESSOR CHIPS; MULTILAYERS; NATURAL FREQUENCIES; OPTIMIZATION; PRINTED CIRCUIT BOARDS; SIGNAL PROCESSING;

ELECTRIC POWER DISTRIBUTION;

EID: 15944383084     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. J-H Kim and M. Swaminathan, "Modeling of multilayered power distribution planes using transmission matrix method", IEEE Trans. Advanced Packaging, vol. 25, No. 2, May 2002, pp. 189-199.
2. C.C. Huang, K.S. Oh, S.L. Wang, and S. Panchapakesan, "Improving the accuracy of on-chip parasitic extraction," IEEE 6th Topical Meeting on Electrical Performance of Electronic Packaging, San Jose, CA, Oct. 27-29, 1997, pp. 42-45.
3. C.C. Huang, "Signal integrity modeling and simulation tools," DesignCon 2004, Santa Clara, CA, Feb. 2-5, 2004.