Erratum: Creep behavior of eutectic Sn-Cu lead-free solder alloy (Journal of Electronic Materials (2002) 31:5 (442-448))

Journal of Electronic Materials

Volumn 31, Issue 7, 2002, Pages 828-

  Wu, C M Lawrence ^a   Huang, M L ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Activation energy; Creep; Eutectic Sn Cu; Lead free solder alloy; Precipitation strengthening

Indexed keywords

EID: 0036637881     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-002-0246-9     Document Type: Erratum

References (0)